BLM7G24S-30BG：LDMOS 2级功率MMIC
BLM7G24S-30BG是采用恩智浦最先进GEN7 LDMOS技术的2级功率MMIC。该器件非常适合用作2100 MHz至2400 MHz频率范围内的通用驱动器。采用鸥翼式。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 2100 | 2400 | MHz | ||
| PL(1dB) | nominal output power at 1 dB gain compression | 30 | W | |||
| Gp | power gain | PL(AV) = 1.6 W; VDS = 28 V | 29.5 | 31.5 | 33.5 | dB |
| RLin | input return loss | PL(AV) = 1.6 W; VDS = 28 V; IDq = 75 mA; IDq2 = 233 mA | -17 | -10 | dB | |
| ηD | drain efficiency | PL(AV) = 1.6 W; VDS = 28 V; f = 2140 MHz | 10 | 11.3 | % | |
| ACPR | adjacent channel power ratio | PL(AV) = 1.6 W; VDS = 28 V; f = 2140 MHz; IDq = 75 mA; IDq2 = 233 mA | -43 | -40 | dB |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BLM7G24S-30BG |  HSOP16 (SOT1212-1) | sot1212-1_po | Reel 13" Q1/T1 in Drypack | 量产 | Standard Marking | BLM7G24S-30BGY( 9340 679 89518 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | VDS(A1) | drain-source voltage of stage A1 |  |  |
| 2 | VGSS(A2) | gate sense FET and gate source voltage of stage A2 | ||
| 3 | VDSS(A2) | drain sense FET source voltage of stage A2 | ||
| 4 | RF_IN_A | RF input path A | ||
| 5 | VGSS(A1) | gate sense FET and gate source voltage of stage A1 | ||
| 6 | VDSS(A1) | drain sense FET source voltage of stage A1 | ||
| 7 | n.c. | not connected | ||
| 8 | n.c. | not connected | ||
| 9 | n.c. | not connected | ||
| 10 | n.c. | not connected | ||
| 11 | n.c. | not connected | ||
| 12 | n.c. | not connected | ||
| 13 | n.c. | not connected | ||
| 14 | n.c. | not connected | ||
| 15 | n.c. | not connected | ||
| 16 | RF_OUT_A/VDS(A2) | RF output path A / drain source voltage of stage A2 | ||
| 17 | GND | RF ground |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BLM7G24S-30BG | BLM7G24S-30BGY |   | 3 | 3 |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BLM7G24S-30BG (中文) | LDMOS 2-stage power MMIC | Data sheet | 2015-07-01 | |
| AN11183 | Mounting and soldering of RF transistors in over-molded plastic packages | Application note | 2012-11-06 | |
| 75017347 | Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| PCB_Design_BLM7G24S-30BG_Data-sheet | PCB Design BLM7G24S-30BG (Data sheet) | Design support | zip | 2013-11-11 |
| fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | 2015-05-19 | |
| sot1212-1_po | plastic, heatsink small outline package; 16 leads(flat) | Outline drawing | 2012-04-17 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BLM7G24S-30BG | 9340 679 89518 | BLM7G24S-30BGY |
其它
| 标题 | 类型 | 日期 |
|---|---|---|
| PCB Design BLM7G24S-30BG (Data sheet) | Design support | 2013-11-11 |
- LDMOS 2-stage power MMIC BLM7G24S-30BG
- Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
- Enabling the Mobile Experience rf
- Fatigue in aluminum bond wires gan_devices
- RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
- plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45ABG
- PCB Design BLM7G24S-30BG (Data sheet) BLM7G24S-30BG
