BLM8G0710S-15PB(G):LDMOS 2-stage power MMIC

The BLM8G0710S-15PB(G) is a dual section, 2-stage power MMIC using NXP’s state of the art GEN8 LDMOS technology. This multiband device is perfectly suited as general purpose driver or small cell final in the frequency range from 700 MHz to 1000 MHz. Available in gull wing or straight lead outline.

特性和优势
    • Designed for broadband operation (frequency 700 MHz to 1000 MHz)
    • High section-to-section isolation enabling multiple combinations
    • Integrated temperature compensated bias
    • Biasing of individual stages is externally accessible
    • Integrated ESD protection
    • Excellent thermal stability
    • High power gain
    • On-chip matching for ease of use
    • Compliant to Directive 2002/95/EC, regarding restriction of hazardous substances (RoHS)
应用
    • RF power MMIC for W-CDMA base stations in the 700 MHz to 1000 MHz frequency range. Possible circuit topologies are the following:
      • Dual section or single ended
      • Doherty
      • Quadrature combined
      • Push-pull
    • Dual section or single ended
    • Doherty
    • Quadrature combined
    • Push-pull
产品图片
关键参数
型号Package versionfrange [min] (MHz)frange [max] (MHz)PL(1dB) (W)VDS (V)η (%)GP (dB)Test signalProduct status
BLM8G0710S-15PBSOT1211-1700100015282736.11-c WCDMA; 1-c WCDMAQualification
BLM8G0710S-15PBGSOT1212-1700100015282736.11-c WCDMA; 1-c WCDMAQualification
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLM8G0710S-15PB
HSOP16F
(SOT1211-1)
sot1211-1_poReel 13" Q1/T1 in Drypack可提供样品Standard MarkingBLM8G0710S-15PBY( 9340 690 29518 )
BLM8G0710S-15PBG
HSOP16
(SOT1212-1)
sot1212-1_poReel 13" Q1/T1 in Drypack可提供样品Standard MarkingBLM8G0710S-15PBGY( 9340 690 31518 )
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLM8G0710S-15PBBLM8G0710S-15PBY33
BLM8G0710S-15PBGBLM8G0710S-15PBGY33
文档资料
档案名称标题类型格式日期
BLM8G0710S-15PB_S-15PBG (中文)LDMOS 2-stage power MMICData sheetpdf2015-07-02
AN11183Mounting and soldering of RF transistors in over-molded plastic packagesApplication notepdf2012-11-06
75017347Enabling the Mobile ExperienceBrochurepdf2013-02-05
75017604Gen8: the latest LDMOS RF power portfolio for wireless infrastructuresLeafletpdf2014-09-04
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
sot1212-1_poplastic, heatsink small outline package; 16 leads(flat)Outline drawingpdf2012-04-17
sot1211-1_poplastic, heatsink small outline package; 16 leads(flat)Outline drawingpdf2013-06-25
订购信息
型号订购码 (12NC)可订购的器件编号
BLM8G0710S-15PB9340 690 29518BLM8G0710S-15PBY
BLM8G0710S-15PBG9340 690 31518BLM8G0710S-15PBGY
LDMOS 2-stage power MMIC BLM8G0710S_15PB_G
Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
Enabling the Mobile Experience rf
Gen8: the latest LDMOS RF power portfolio for wireless infrastructures base_stations
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45ABG
plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45AB