BLP8G10S-270PW:Power LDMOS transistor

270 W LDMOS packaged symmetric Doherty power transistor for base station applications at frequencies from 700 MHz to 900 MHz.

特性和优势
    • Excellent ruggedness
    • High-efficiency
    • Low thermal resistance providing excellent thermal stability
    • Lower output capacitance for improved performance in Doherty applications
    • Designed for low memory effects providing excellent digital pre-distortion capability
    • Internally matched for ease of use
    • Integrated ESD protection
    • Bias through video leads
    • Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS)
应用
    • RF power amplifiers for base stations and multi carrier applications in the 700 MHz to 900 MHz frequency range
产品图片
关键参数
SymbolParameterConditionsMinTyp/NomMaxUnit
frangefrequency range700900MHz
PL(1dB)nominal output power at 1 dB gain compression270W
Gppower gainPL(AV) = 56 W; VDS = 28 V [0]18.6dB
ηDdrain efficiencyPL(AV) = 56 W; VDS = 28 V [0]49.6%
ACPRadjacent channel power ratioPL(AV) = 56 W; VDS = 28 V [0]-45dBc
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLP8G10S-270PW
HSOP6F
(SOT1221-1)
sot1221-1_poReel 13" Q1/T1 in Drypack开发中Standard MarkingBLP8G10S-270PWY( 9340 692 58518 )
引脚配置信息
PinSymbolDescription外形简图图形符号
1GATEgate
2GATEgate
3BVDbias/video decoupling
4DRAINdrain
5DRAINdrain
6BVDbias/video decoupling
7SOURCEsource
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLP8G10S-270PWBLP8G10S-270PWY33
文档资料
档案名称标题类型格式日期
AN11183Mounting and soldering of RF transistors in over-molded plastic packagesApplication notepdf2012-11-06
75017347Enabling the Mobile ExperienceBrochurepdf2013-02-05
75017604Gen8: the latest LDMOS RF power portfolio for wireless infrastructuresLeafletpdf2014-09-04
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
sot1221-1_poplastic, heatsink small outline package; 6 leads(flat)Outline drawingpdf2012-07-24
订购信息
型号订购码 (12NC)可订购的器件编号
BLP8G10S-270PW9340 692 58518BLP8G10S-270PWY
Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
Enabling the Mobile Experience rf
Gen8: the latest LDMOS RF power portfolio for wireless infrastructures base_stations
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
plastic, heatsink small outline package; 6 leads(flat) BLP8G21S-160PV