BLP8G27-10：Power LDMOS transistor
10 W plastic LDMOS power transistor for base station applications at frequencies from 700 MHz to 2700 MHz.
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 700 | 2700 | MHz | ||
| PL(1dB) | nominal output power at 1 dB gain compression | 10 | W | |||
| Gp | power gain | VDS = 28 V [0] | 17 | dB | ||
| ηD | drain efficiency | VDS = 28 V [0] | 22 | % | ||
| ACPR5M | adjacent channel power ratio (5 MHz) | VDS = 28 V [0] | -47.3 | dBc |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BLP8G27-10 |  HVSON16 (SOT1371-1) | sot1371-1_po | sot1371-1_fr | Reel 7" Q1/T1 in Drypack | 可提供样品 | Standard Marking | BLP8G27-10Z( 9340 689 76515 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 0 | GND | ground (exposed die pad) |  |  |
| 1 | n.c. | no connection | ||
| 2 | n.c. | not connected | ||
| 3 | G | gate | ||
| 4 | G | gate | ||
| 5 | G | gate | ||
| 6 | G | gate | ||
| 7 | n.c. | not connected | ||
| 8 | n.c. | not connected | ||
| 9 | n.c. | not connected | ||
| 10 | n.c. | not connected | ||
| 11 | D | drain | ||
| 12 | D | drain | ||
| 13 | D | drain | ||
| 14 | D | drain | ||
| 15 | n.c. | not connected | ||
| 16 | n.c. | not connected |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BLP8G27-10 | BLP8G27-10Z |   | Always Pb-free | 3 | 3 |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| AN10896 | Mounting and Soldering of RF transistors | Application note | 2015-03-24 | |
| 75017347 | Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| PCB_Design_BLP8G27-10_Data-sheet | PCB Design BLP8G27-10 (Data sheet) | Design support | zip | 2015-07-17 |
| 75017604 | Gen8: the latest LDMOS RF power portfolio for wireless infrastructures | Leaflet | 2014-09-04 | |
| fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | 2015-05-19 | |
| SOT1371-1_515 | HVSON16; Reel dry pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,515 or Z Ordering code (12NC) ending 515 | Packing | 2015-06-01 | |
| sot1371-1_po | plastic thermal enhanced very thin small outline package; no leads; 16 terminals; body 4 x 6 x 0.85 mm | Outline drawing | 2014-05-20 | |
| sot1371-1_fr | sot1371-1_fr | Reflow soldering | 2014-09-09 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BLP8G27-10 | 9340 689 76515 | BLP8G27-10Z |
其它
| 标题 | 类型 | 日期 |
|---|---|---|
| PCB Design BLP8G27-10 (Data sheet) | Design support | 2015-07-17 |
- Mounting and Soldering of RF transistors aerospace_defense
- Enabling the Mobile Experience rf
- Gen8: the latest LDMOS RF power portfolio for wireless infrastructures base_stations
- Fatigue in aluminum bond wires gan_devices
- RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
- HVSON16; Reel dry pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,515 or Z Ordering code (12NC) e BLP8G27-5
- plastic thermal enhanced very thin small outline package; no leads; 16 terminals; body 4 x 6 x 0.85 mm BLP8G27-5
- sot1371-1_fr BLP8G27-5
- PCB Design BLP8G27-10 (Data sheet) BLP8G27-10
