BLP8G27-5:Power LDMOS transistor

5 W plastic LDMOS power transistor for base station applications at frequencies from 700 MHz to 2700 MHz.

特性和优势
    • High efficiency
    • Excellent ruggedness
    • Designed for broadband operation
    • Excellent thermal stability
    • High power gain
    • Integrated ESD protection
    • Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS)
应用
    • CDMA
    • W-CDMA
    • GSM EDGE
    • MC-GSM
    • LTE
    • WiMAX
产品图片
关键参数
SymbolParameterConditionsMinTyp/NomMaxUnit
frangefrequency range7002700MHz
PL(1dB)nominal output power at 1 dB gain compression5W
Gppower gainVDS = 28 V [0]19dB
ηDdrain efficiencyVDS = 28 V [0]19%
ACPR5Madjacent channel power ratio (5 MHz)VDS = 28 V [0]-50dBc
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLP8G27-5
HVSON16
(SOT1371-1)
sot1371-1_posot1371-1_frReel 7" Q1/T1 in Drypack可提供样品Standard MarkingBLP8G27-5Z( 9340 689 75515 )
引脚配置信息
PinSymbolDescription外形简图图形符号
0GNDground (exposed die pad)
1n.c.no connection
2n.c.not connected
3Ggate
4Ggate
5n.c.not connected
6n.c.not connected
7n.c.not connected
8n.c.not connected
9n.c.not connected
10n.c.not connected
11n.c.not connected
12n.c.not connected
13Ddrain
14Ddrain
15n.c.not connected
16n.c.not connected
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLP8G27-5BLP8G27-5ZAlways Pb-free33
文档资料
档案名称标题类型格式日期
AN10896Mounting and Soldering of RF transistorsApplication notepdf2015-03-24
75017347Enabling the Mobile ExperienceBrochurepdf2013-02-05
PCB_Design_BLP8G27-5_Data-sheetPCB Design BLP8G27-5 (Data sheet)Design supportzip2015-07-24
75017604Gen8: the latest LDMOS RF power portfolio for wireless infrastructuresLeafletpdf2014-09-04
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
SOT1371-1_515HVSON16; Reel dry pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,515 or Z Ordering code (12NC) ending 515Packingpdf2015-06-01
sot1371-1_poplastic thermal enhanced very thin small outline package; no leads; 16 terminals; body 4 x 6 x 0.85 mmOutline drawingpdf2014-05-20
sot1371-1_frsot1371-1_frReflow solderingpdf2014-09-09
订购信息
型号订购码 (12NC)可订购的器件编号
BLP8G27-59340 689 75515BLP8G27-5Z
其它
标题类型日期
PCB Design BLP8G27-5 (Data sheet)Design support2015-07-24
Mounting and Soldering of RF transistors aerospace_defense
Enabling the Mobile Experience rf
Gen8: the latest LDMOS RF power portfolio for wireless infrastructures base_stations
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
HVSON16; Reel dry pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,515 or Z Ordering code (12NC) e BLP8G27-5
plastic thermal enhanced very thin small outline package; no leads; 16 terminals; body 4 x 6 x 0.85 mm BLP8G27-5
sot1371-1_fr BLP8G27-5
PCB Design BLP8G27-5 (Data sheet) BLP8G27-5