数据手册DataSheet 下载：PMZ270XN N沟道TrenchMOS极低电平FET.pdf
极低电平N沟道增强型场效应晶体管(FET)，采用使用TrenchMOS技术的塑料封装。该产品仅设计适合用于计算、通信、消费电子和工业应用。
产品特点
| 产品应用
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订购型号
| 订购型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 订购器件的编号 |
| PMZ270XN | DFN1006-3 (SOT883) | sot883_po | Reflow_Soldering_Profile | Tape reel smd | 激活 | Z4 | PMZ270XN,315( 9340 601 55315 ) |
品质、可靠性及RoHS化学成分
| 订购型号 | 订购器件的编号 | RoHS / RHF | 无铅开始日期 | EFR | IFR (FIT) | MTBF（小时） | 潮湿敏感度等级 | MSL LF |
| PMZ270XN | PMZ270XN,315 |   | Always Pb-free | 220.0 | 1.02 | 9.79E8 | 1 | 1 |
产品技术资料
- Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7M12-60E
- Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7K6R8-40E
- Broad small-signal MOSFET portfolio to suit a wide range of applications BSS84AKW
- PMZ270XN NXP Product Quality PMZ270XN
- PMZ270XN_4_4_2011 Spice parameter PMZ270XN
- Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- leadless ultra small plastic package; 3 solder lands PMZ950UPE
- Footprint for reflow soldering SOT883 PMZ950UPE
