SN74LVC1G00-EP 增强型产品二路 2 输入正与非门

This single 2-input positive-NAND gate is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G00 performs the Boolean function Y = A • B or Y = A + B in positive logic.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down

SN74LVC1G00-EP
Pin/Package 5SC70, 5SOT-23  
Operating Temperature Range(°C) -40 to 85,-55 to 125  
IOL(mA) 32  
Voltage Nodes(V) 1.8, 2.5, 3.3, 5  
IOH(mA) -32  
Vcc max(V) 5.5  
Technology Family LVC  
Vcc min(V) 1.65  
tpd max(ns) 4  
ICC(uA) 10  
Rating HiRel Enhanced Product  
SN74LVC1G00-EP 特性
SN74LVC1G00-EP 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74LVC1G00IDCKREP ACTIVE -40 to 85 0.16 | 1ku SC70 (DCK) | 5 3000 | LARGE T&R CAO
SN74LVC1G00MDBVREP ACTIVE -55 to 125 0.43 | 1ku SOT-23 (DBV) | 5 3000 | LARGE T&R SBFM
SN74LVC1G00MDCKREP ACTIVE -55 to 125 0.43 | 1ku SC70 (DCK) | 5 3000 | LARGE T&R BYA
V62/04732-01XE ACTIVE -40 to 85 0.16 | 1ku SC70 (DCK) | 5 3000 | LARGE T&R CAO
V62/04732-02XE ACTIVE -55 to 125 0.43 | 1ku SC70 (DCK) | 5 3000 | LARGE T&R SBFM
V62/04732-02YE ACTIVE -55 to 125 0.43 | 1ku SOT-23 (DBV) | 5 3000 | LARGE T&R BYA
SN74LVC1G00-EP 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74LVC1G00IDCKREP Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G00IDCKREP SN74LVC1G00IDCKREP
SN74LVC1G00MDBVREP Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G00MDBVREP SN74LVC1G00MDBVREP
SN74LVC1G00MDCKREP Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G00MDCKREP SN74LVC1G00MDCKREP
V62/04732-01XE Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM V62/04732-01XE V62/04732-01XE
V62/04732-02XE Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM V62/04732-02XE V62/04732-02XE
V62/04732-02YE Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM V62/04732-02YE V62/04732-02YE
SN74LVC1G00-EP 应用技术支持与电子电路设计开发资源下载
  1. SN74LVC1G00-EP 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器门电路产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)