AM26LV32E 具有 +/-15kV IEC ESD 的低电压高速四路差动线路接收器
The AM26LV32E consists of quadruple differential line receivers with 3-state outputs. These differential receivers have ±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge) protection for RS422 bus pins.
This device is designed to meet TIA/EIA-422-B and ITU recommendation V.11 drivers with reduced supply voltage. The device is optimized for balanced bus transmission at switching rates up to 32 MHz. The 3-state outputs permit connection directly to a bus-organized system.
The AM26LV32E has an internal fail-safe circuitry that prevents the device from putting an unknown voltage signal at the receiver outputs. In the open fail-safe, shorted fail-safe, and terminated fail-safe, a high state is produced at the respective output.
This device is supported for partial-power-down applications using Ioff. Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
The AM26LV32EI is characterized for operation from –40°C to 85°C
| AM26LV32E | |
| Receivers Per Package | 4 |
| Supply Voltage(s)(V) | 3.3 |
| Supply Voltage(s)(Min)(V) | 3 |
| Supply Voltage(s)(Max)(V) | 3.6 |
| ESD(kV) | 15 |
| Signaling Rate(Mbps) | 32 |
| Temp Range(C) | -40 to 85 |
| Rating | Catalog |
| Operating Temperature Range(�C) | -40 to 85 |
| # of TX/RX | 0 TX / 4 RX |
| Pin/Package | 16SO, 16SOIC, 16TSSOP, 16VQFN |
AM26LV32E 特性
- Meets or Exceeds Standard TIA/EIA-422-B and ITU Recommendation V.11
- Operates From a Single 3.3-V Power Supply
- ESD Protection for RS422 Bus Pins
- ±15-kV Human-Body Model (HBM)
- ±8-kV IEC61000-4-2, Contact Discharge
- ±15-kV IEC61000-4-2, Air-Gap Discharge
- Switching Rates up to 32 MHz
- Low Power Dissipation: 27 mW Typ
- Open-Circuit, Short-Circuit, and Terminated Fail-Safe
- ±7-V Common-Mode Input Voltage Range With ±200-mV Sensitivity
- Accepts 5-V Logic Inputs With 3.3-V Supply (Enable Inputs)
- Input Hysteresis: 35 mV Typ
- Pin-to-Pin Compatible With AM26C32, AM26LS32
- Ioff Supports Partial-Power-Down Mode Operation
- Package Options: SOP, SOIC, TSSOP, QFN
AM26LV32E 芯片订购指南
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| AM26LV32EIDR | ACTIVE | -40 to 85 | 0.90 | 1ku | SOIC (D) | 16 | 2500 | LARGE T&R | |
| AM26LV32EIDRG4 | ACTIVE | -40 to 85 | 0.90 | 1ku | SOIC (D) | 16 | 2500 | LARGE T&R | |
| AM26LV32EINSR | ACTIVE | -40 to 85 | 0.90 | 1ku | SO (NS) | 16 | 2000 | LARGE T&R | |
| AM26LV32EINSRG4 | ACTIVE | -40 to 85 | 0.90 | 1ku | SO (NS) | 16 | 2000 | LARGE T&R | |
| AM26LV32EIPWR | ACTIVE | -40 to 85 | 0.90 | 1ku | TSSOP (PW) | 16 | 2000 | LARGE T&R | |
| AM26LV32EIPWRG4 | ACTIVE | -40 to 85 | 0.90 | 1ku | TSSOP (PW) | 16 | 2000 | LARGE T&R | |
| AM26LV32EIRGYR | ACTIVE | -40 to 85 | 0.90 | 1ku | VQFN (RGY) | 16 | 3000 | LARGE T&R | |
| AM26LV32EIRGYRG4 | ACTIVE | -40 to 85 | 0.90 | 1ku | VQFN (RGY) | 16 | 3000 | LARGE T&R |
AM26LV32E 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| AM26LV32EIDR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | AM26LV32EIDR | AM26LV32EIDR |
| AM26LV32EIDRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | AM26LV32EIDRG4 | AM26LV32EIDRG4 |
| AM26LV32EINSR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | AM26LV32EINSR | AM26LV32EINSR |
| AM26LV32EINSRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | AM26LV32EINSRG4 | AM26LV32EINSRG4 |
| AM26LV32EIPWR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | AM26LV32EIPWR | AM26LV32EIPWR |
| AM26LV32EIPWRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | AM26LV32EIPWRG4 | AM26LV32EIPWRG4 |
| AM26LV32EIRGYR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | AM26LV32EIRGYR | AM26LV32EIRGYR |
| AM26LV32EIRGYRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | AM26LV32EIRGYRG4 | AM26LV32EIRGYRG4 |
AM26LV32E 应用技术支持与电子电路设计开发资源下载
- AM26LV32E 数据资料 dataSheet 下载.PDF
- TI 德州仪器RS-422选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
