| NA556 | NE556 | SA556 | |
| Frequency (Max) (MHz) | 0.5 | 0.5 | |
| VCC (Min) (V) | 4.5 | 4.5 | 4.5 |
| VCC (Max) (V) | 16 | 16 | 16 |
| Operating Temperature Range (C) | -40 to 105 | 0 to 70 | -40 to 85 |
| Pin/Package | 14PDIP, 14SOIC | 14SO, 14SOIC, 14PDIP, 14SSOP | 14PDIP |
| Approx. Price (US$) | 0.27 | 1ku | 0.18 | 1ku | 0.22 | 1ku |
| 器件 | 状态 | 温度 | 价格（美元） | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| NA556D | ACTIVE | 0 to 70 | 0.33 | 1ku | SOIC (D) | 14 | 50 | TUBE | |
| NA556DG4 | ACTIVE | 0 to 70 | 0.33 | 1ku | SOIC (D) | 14 | 50 | TUBE | |
| NA556DR | ACTIVE | 0 to 70 | 0.27 | 1ku | SOIC (D) | 14 | 2500 | LARGE T&R | |
| NA556DRG4 | ACTIVE | 0 to 70 | 0.27 | 1ku | SOIC (D) | 14 | 2500 | LARGE T&R | |
| NA556N | ACTIVE | 0 to 70 | 0.27 | 1ku | PDIP (N) | 14 | 25 | TUBE | |
| NA556NE4 | ACTIVE | 0 to 70 | 0.27 | 1ku | PDIP (N) | 14 | 25 | TUBE |
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| NA556D | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | NA556D | NA556D |
| NA556DG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | NA556DG4 | NA556DG4 |
| NA556DR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | NA556DR | NA556DR |
| NA556DRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | NA556DRG4 | NA556DRG4 |
| NA556N | Pb-Free (RoHS) | CU NIPDAU | N/A for Pkg Type | NA556N | NA556N |
| NA556NE4 | Pb-Free (RoHS) | CU NIPDAU | N/A for Pkg Type | NA556NE4 | NA556NE4 |
