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OMAP3503-HIREL 具有立体声 ADC 和路由的 216kHz 数字音频接口收发器 (DIX)

OMAP3503 high-performance, applications processor is based on the enhanced OMAP™ 3 architecture.

The OMAP™ 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

• Streaming video
• 3D mobile gaming
• Video conferencing
• High-resolution still image

The device supports high-level operating systems (OSs), such as:

• Linux
• Windows CE

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

• Microprocessor unit (MPU) subsystem based on the ARM Cortex™-A8 microprocessor
• Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
• Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays

	OMAP3503-HIREL
MMC/SD	3
UART (SCI)	3
I2C	33
McBSP	5
DMA (Ch)	64-Ch EDMA,32-Bit Channel SDMA
Video Port (Configurable)	1 Dedicated Output, 1 Dedicated Input
IO Supply (V)	1.8 V,3.0 V (MMC1 Only)
Operating Temperature Range (C)	-45 to 85
Pin/Package	515POP-FCBGA

OMAP3503-HIREL 特性

• OMAP3503 Applications Processor:
  • OMAP™ 3 Architecture
  • MPU Subsystem
    • Up to 720-MHz ARM Cortex™-A8 Core
    • NEON™ SIMD Coprocessor
  • Fully Software-Compatible With ARM9™
  • Commercial and Extended Temperature Grades
• ARM Cortex™-A8 Core
  • ARMv7 Architecture
    • Trust Zone®
    • Thumb®-2
    • MMU Enhancements
  • In-Order, Dual-Issue, Superscalar Microprocessor Core
  • NEON™ Multimedia Architecture
  • Over 2x Performance of ARMv6 SIMD
  • Supports Both Integer and Floating Point SIMD
  • Jazelle® RCT Execution Environment Architecture
  • Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
  • Embedded Trace Macrocell (ETM) Support for Non-Invasive Debug
• ARM Cortex™-A8 Memory Architecture

OMAP3503-HIREL 芯片订购指南

器件	状态	温度	价格（美元）	封装 | 引脚	封装数量 | 封装载体	丝印标记
OMAP3503DZCBCS	ACTIVE	-45 to 85	23.50 | 1ku	POP-FCBGA (CBC) | 515	168 | JEDEC TRAY (10+1)

OMAP3503-HIREL 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
OMAP3503DZCBCS	Green (RoHS & no Sb/Br)	Call TI	Level-3-260C-168 HR	OMAP3503DZCBCS	OMAP3503DZCBCS

OMAP3503-HIREL 应用技术支持与电子电路设计开发资源下载

1. OMAP3503-HIREL 数据资料 dataSheet 下载.PDF
2. TI 德州仪器Sitara ARM Cortex-A8 和 ARM9 微处理器选型与价格 . xls