SN65LVDT14-EP MemoryStick(TM) 互联扩展器芯片组
The SN65LVDT14 combines one LVDS line driver with four terminated LVDS line receivers in one package. It is designed to be used at the Memory Stick™ end of an LVDS-based Memory Stick interface extension.
The SN65LVDT41 combines four LVDS line drivers with a single terminated LVDS line receiver in one package. It is designed to be used at the host end of an LVDS-based Memory Stick interface extension
SN65LVDT14-EP
Input Signal
LVDS, LVTTL
Output Signal
LVDS, LVTTL
No. of Rx
4
No. of Tx
1
Signaling Rate(Mbps)
125
Supply Voltage(s)(V)
3.3
ICC(Max)(mA)
25
Rx tpd(Typ)(ns)
2.6
Tx tpd(Typ)(ns)
1.7
Part-to-Part Skew(Max)(ps)
1000
Pin/Package
20TSSOP
Operating Temperature Range(°C)
-40 to 125
ESD HBM(kV)
12
SN65LVDT14-EP 特性
Controlled Baseline
One Assembly/Test Site, One Fabrication Site
Enhanced Diminishing Manufacturing Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree
Integrated 110- Nominal Receiver Line Termination Resistor
Operate From a Single 3.3-V Supply
Greater Than 125-Mbps Data Rate
Flow-Through Pinout
LVTTL-Compatible Logic I/Os
ESD Protection on Bus Pins Exceeds 12 kV
Meet or Exceed Requirements of ANSI/TIA/EIA-644A Standard for LVDS
20-Pin Thin Shrink Small-Outline Package (PW) With 26-Mil Terminal Pitch
APPLICATIONS
Memory Stick™ Interface Extensions With Long Interconnects Between Host and
Memory Stick
Serial Peripheral Interface™ (SPI™) Interface Extension to Allow Long Interconnects
Between Master and Slave
MultiMediaCard™ (MMC) Interface in SPI Mode
General-Purpose Asymmetric Bidirectional Communication
SN65LVDT14-EP 芯片订购指南
器件
状态
温度
价格
封装 | 引脚
封装数量 | 封装载体
丝印标记
SN65LVDT14QPWREP
ACTIVE
-40 to 125
3.95 | 100u
TSSOP (PW) | 20
2000 | LARGE T&R
V62/05615-01XE
ACTIVE
-40 to 125
3.95 | 100u
TSSOP (PW) | 20
2000 | LARGE T&R
SN65LVDT14-EP 质量与无铅数据
器件
环保计划*
铅/焊球涂层
MSL 等级/回流焊峰
环保信息与无铅 (Pb-free)
DPPM / MTBF / FIT 率
SN65LVDT14QPWREP
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDT14QPWREP
SN65LVDT14QPWREP
V62/05615-01XE
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/05615-01XE
V62/05615-01XE
SN65LVDT14-EP 应用技术支持与电子电路设计开发资源下载
SN65LVDT14-EP 数据资料 dataSheet 下载 .PDF
TI 德州仪器LVDS PHYs选型与价格 . xls
所选封装材料的热学和电学性质 (PDF 645 KB)
使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
接口选择指南 (Rev. D) (PDF 2994 KB)
Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
Isolated RS-485 Reference Design (PDF 80 KB)
无铅组件涂层的保存期评估 (PDF 1305 KB)
Analog Signal Chain Guide (8.62 MB)
Industrial Interface IC Solutions (101 KB)