TLK2208B 八路千兆以太网收发器

The TLK2208B is the third generation of Gigabit Ethernet transceivers from Texas Instruments combining high port density and ultralow power in a small form-factor footprint. The TLK2208B provides for high-speed full-duplex point-to-point data transmissions based on the IEEE 802.3z 1000-Mbps Ethernet specification. The TLK2208B supports data rates from 1.0 Gbps through 1.3 Gbps.

The primary application of this device is to provide building blocks for developing point-to-point baseband data transmission over controlled impedance media of 50 . The transmission media can be printed circuit board traces, copper cables or fiber-optical interface modules. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment

TLK2208B
Gbps per Serial Channel(Min) 1  
Gbps per Serial Channel(Max) 1.3  
ICC(Max)(mA) 340  
IIH(Max)(uA) 40  
IIL(Max)(uA) -600  
Power Consumption(Nom)(mW) 1385  
Number of Serial Channels 8  
Parallel Bus Width 10  
Parallel I/F LVCMOS  
Serial I/F VML  
Operating Temperature Range(C) 0 to 70  
Pin/Package 289BGA  
VCC(Min)(V) 1.7  
VCC(Max)(V) 1.9  
VCC(Nom)(V) 1.8  
VIH(Min)(V) 1.17  
VIH(Max)(V) 2  
VIL(Max)(V) 0.63
TLK2208B 特性
TLK2208B 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
TLK2208BGPV ACTIVE 0 to 70 31.50 | 1ku BGA (GPV) | 289 84 | JEDEC TRAY (10+1)  
TLK2208BZPV ACTIVE 0 to 70 31.50 | 1ku BGA (ZPV) | 289 84 | JEDEC TRAY (10+1)  
TLK2208B 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TLK2208BGPV TBD  Call TI  Level-3-220C-168 HR TLK2208BGPV TLK2208BGPV
TLK2208BZPV Green (RoHS & no Sb/Br)  SNAGCU  Level-3-260C-168 HR TLK2208BZPV TLK2208BZPV
TLK2208B 应用技术支持与电子电路设计开发资源下载
  1. TLK2208B 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器串行器和解串器选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
  6. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  7. 接口选择指南 (Rev. D) (PDF 2994 KB)
  8. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  9. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  10. Isolated RS-485 Reference Design (PDF 80 KB)
  11. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  12. Analog Signal Chain Guide (8.62 MB)
  13. Industrial Interface IC Solutions (101 KB)
TLK2208B 工具和软件
培训内容 型号 软件/工具类型
TLK2208B 评估模块 TLK2208BEVM 开发电路板/EVM
TLK2208B 评估模块 TLK2208BEVM-001 开发电路板/EVM
TLK2208B 评估模块 TLK2208BEVM-003 开发电路板/EVM