TLK2701 1.6 至 2.7GBPS 收发器

The TLK2701 is a member of the transceiver family of multigigabit transceivers, intended for use in ultrahigh-speed bidirectional point-to-point data transmission systems. The TLK2701 supports an effective serial interface speed of 1.6 Gbps to 2.7 Gbps, providing up to 2.16 Gbps of data bandwidth.

The primary application of this chip is to provide very high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50 Ω. The transmission media can be printed-circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment

TLK2701
mW per Serial Channel 350  
Gbps per Serial Channel(Min) 1.6  
Gbps per Serial Channel(Max) 2.7  
ICC(Max)(mA) 156  
Power Consumption(Nom)(mW) 390  
Number of Serial Channels 1  
Parallel Bus Width 16  
Serial I/F CML  
Parallel I/F LVTTL  
Operating Temperature Range(C) -40 to 85  
Pin/Package 64HVQFP  
VCC(Min)(V) 2.3  
VCC(Max)(V) 2.7  
VCC(Nom)(V) 2.5  
VIH(Min)(V) 2  
VIH(Max)(V) 3.6  
VIL(Max)(V) 0.8  
Vid(Min)(Vp-p) 0.2  
Vod(Min)(Vp-p) 0.84  
Vod(Max)(Vp-p) 1.26
TLK2701 特性
TLK2701 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
TLK2701IRCP ACTIVE -40 to 85 15.90 | 1ku HVQFP (RCP) | 64 160 | JEDEC TRAY (10+1)  
TLK2701IRCPG4 ACTIVE -40 to 85 15.90 | 1ku HVQFP (RCP) | 64 160 | JEDEC TRAY (10+1)  
TLK2701IRCPR ACTIVE -40 to 85 14.40 | 1ku HVQFP (RCP) | 64 1000 | LARGE T&R  
TLK2701IRCPRG4 ACTIVE -40 to 85 14.40 | 1ku HVQFP (RCP) | 64 1000 | LARGE T&R  
TLK2701 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TLK2701IRCP Green (RoHS & no Sb/Br)  CU NIPDAU  Level-3-260C-168 HR TLK2701IRCP TLK2701IRCP
TLK2701IRCPG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-3-260C-168 HR TLK2701IRCPG4 TLK2701IRCPG4
TLK2701IRCPR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-3-260C-168 HR TLK2701IRCPR TLK2701IRCPR
TLK2701IRCPRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-3-260C-168 HR TLK2701IRCPRG4 TLK2701IRCPRG4
TLK2701 应用技术支持与电子电路设计开发资源下载
  1. TLK2701 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器串行器和解串器选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
  6. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  7. 接口选择指南 (Rev. D) (PDF 2994 KB)
  8. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  9. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  10. Isolated RS-485 Reference Design (PDF 80 KB)
  11. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  12. Analog Signal Chain Guide (8.62 MB)
  13. Industrial Interface IC Solutions (101 KB)
TLK2701 工具和软件
培训内容 型号 软件/工具类型
TLK2701 评估模块 TLK2701EVM 开发电路板/EVM
TLK2701FPGAEVM 评估模块 TLK2701FPGAEVM 开发电路板/EVM
TLK2701SMAEVM 评估模块 TLK2701SMAEVM 开发电路板/EVM