TPD12S521 HDMI 接收器端口保护和接口设备

The TPD12S521 is a single-chip ESD solution for the high-definition multimedia interface (HDMI) transmitter port. In many cases, the core ICs, such as the scalar chipset, may not have robust ESD cells to sustain system-level ESD strikes. In these cases, the TPD12S521 provides the desired system-level ESD protection, such as the the IEC61000-4-2 (Level 4) ESD, by absorbing the energy associated with the ESD strike.

While providing the ESD protection, the TPD12S521 adds little or no additional glitch in the high-speed differential signals (see Figure 5 and Figure 6). The high-speed transition minimized differential signaling (TMDS) lines add only 0.9-pF capacitance to the lines. In addition, the monolithic integrated circuit technology ensures that there is excellent matching between the two-signal pair of the differential line. This is a direct advantage over discrete ESD clamp solutions where variations between two different ESD clamps may significantly degrade the differential signal quality.

The low-speed control lines offer voltage-level shifting to eliminate the need for an external voltage level-shifter IC. The control line ESD clamps add 3.5-pF capacitance to the control lines. The 38-pin DBT package offers seamless layout routing option to eliminate the routing glitch for the differential signal pair.

The TPD12S521 provides an on-chip regulator with current output ratings of 55 mA at pin 38. This current enables HDMI receiver detection even when the receiver device is powered off. DBT package pitch (0.5 mm) matches with HDMI connector pitch. In addition, pin mapping follows the same order as the HDMI connector pin mapping. This HDMI receiver port protection and interface device is specifically designed for next-generation HDMI transmitter protection

TPD12S521
Number of Channels 12  
IEC 61000-4-2 Contact(+/- kV) +/-8  
IEC 61000-4-2 Air-Gap(+/- kV) 0.8  
IO Capacitance(Typ)(pF) 0.05  
Breakdown Voltage(Min)(V) 9  
IO Leakage Current(nA) 10  
Operating Temperature Range(°C) -40 to 85
TPD12S521 特性
TPD12S521 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
TPD12S521DBTR ACTIVE -40 to 85 0.44 | 1ku TSSOP (DBT) | 38 2000 | LARGE T&R  
TPD12S521 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TPD12S521DBTR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-2-260C-1 YEAR TPD12S521DBTR TPD12S521DBTR
TPD12S521 应用技术支持与电子电路设计开发资源下载
  1. TPD12S521 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器ESD 解决方案选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 接口选择指南 (Rev. D) (PDF 2994 KB)
  5. ESD Protection Guide (PDF 2885 KB)
  6. Reading and Understanding an ESD Protection Datasheet (PDF 2523 KB)
  7. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  8. Isolated CAN Reference Design (PDF 48 KB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Isolated CAN EVM User's Guide (PDF 1168 KB)
  12. Energy Harvesting: Solar Solutions Guide (PDF 409 KB)
  13. Analog Signal Chain Guide (8.62 MB)
  14. Industrial Interface IC Solutions (101 KB)