TPD2E007 用于 AC 信号数据接口的 2 通道 ESD 保护阵列

This device is an application-specific integrated parts (ASIP) designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, etc.) without compromising signal integrity. The PicoStar™ package is intended to be embedded inside the printed circuit board which saves board space in portable applications. This device exceeds the IEC61000-4-2 (Level 4) ESD protection and suitable to provide system level ESD protection for the valuable internal ICs while placed near the connector.

The TPD2E007 is offered in a 4-bump PicoStar™ and 3-pin DCK packages

TPD2E007
Number of Channels 2  
IEC 61000-4-2 Contact(+/- kV) +/-8  
IEC 61000-4-2 Air-Gap(+/- kV) +/-15  
IO Capacitance(Typ)(pF) 15  
Breakdown Voltage(Min)(V) +/-14  
IO Leakage Current(nA) 50  
Operating Temperature Range(°C) -40 to 85
TPD2E007 特性
TPD2E007 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
TPD2E007DCKR ACTIVE -40 to 85 0.20 | 1ku SC70 (DCK) | 3 3000 | LARGE T&R  
TPD2E007YFMR PREVIEW -40 to 85   DSLGA (YFM) | 4    
TPD2E007YFMRG4 ACTIVE -40 to 85 0.20 | 1ku DSLGA (YFM) | 4 3000 | LARGE T&R  
TPD2E007 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TPD2E007DCKR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-2-260C-1 YEAR TPD2E007DCKR TPD2E007DCKR
TPD2E007YFMRG4 Green (RoHS & no Sb/Br)  Call TI  Level-1-260C-UNLIM TPD2E007YFMRG4 TPD2E007YFMRG4
TPD2E007 应用技术支持与电子电路设计开发资源下载
  1. TPD2E007 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器ESD 解决方案选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 接口选择指南 (Rev. D) (PDF 2994 KB)
  5. ESD Protection Guide (PDF 2885 KB)
  6. Reading and Understanding an ESD Protection Datasheet (PDF 2523 KB)
  7. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  8. Isolated CAN Reference Design (PDF 48 KB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Isolated CAN EVM User's Guide (PDF 1168 KB)
  12. Energy Harvesting: Solar Solutions Guide (PDF 409 KB)
  13. Analog Signal Chain Guide (8.62 MB)
  14. Industrial Interface IC Solutions (101 KB)