TPD4S009 用于高速数据接口的 4 通道 ESD 保护阵列

The TPD4S009 and TPD4S010 provide system level electrostatic discharge (ESD) solution for high-speed differential lines. These devices offer four ESD clamp circuits for dual pair differential lines. The TPD4S009 offers an optional VCC supply pin which can be connected to system supply plane. There is a blocking diode at the VCC pin to enable the Ioff feature for the TPD4S009. The TPD4S009 can handle live signal at the D+, D- pins when the VCC pin is connected to zero volt. The VCC pin allows all the internal circuit nodes of the TPD4S009 to be at known potential during start up time. However, connecting the optional VCC pin to board supply plane doesn't affect the system level ESD performance of the TPD4S009. The TPD4S010 does not offer the VCC pin.

The TPD4S009 is offered in DBV, DCK, DGS, and DRY packages. The TPDS4010 is offered in DQA package. The TPD4S009DRYR is the most space saving package option available for dual pair high-speed differential lines. The TPD4S009DGSR and TPD4S010DQAR offer flow-through board layout option to reduce signal glitches due to mismatch between the D+ and D- signal pair routing.

The monolithic silicon technology allows matching between the differential signal pairs. The excellent matching between the differential pair signal lines (0.05-pF line-line capacitance for the TPD4S009DRY) enables this device to operate at high-speed differential data rates (3-dB bandwidth > 4 GHz). The TPD4S009 and TPD4S010 are suitable for high-speed differential applications, such as high-definition multimedia interface (HDMI), low-voltage differential signaling (LVDS), serial advanced technology attachment (SATA), Ethernet, 1394 (FireWire)®, etc.

TPD4S009/TPD4S010 comply with IEC 61000-4-2 (Level 4) ESD.

TPD4S009/TPD4S010 are characterized for operation over the ambient air temperature range of –40°C to 85°C

TPD4S009
Number of Channels 4  
IEC 61000-4-2 Contact(+/- kV) +/-8  
IEC 61000-4-2 Air-Gap(+/- kV) +/-9  
IO Capacitance(Typ)(pF) 0.8  
Differential Capacitance(pF) 0.05  
Breakdown Voltage(Min)(V) 9  
IO Leakage Current(nA) 10  
Operating Temperature Range(°C) -40 to 85
TPD4S009 特性
TPD4S009 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
TPD4S009DBVR ACTIVE -40 to 85 0.29 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
TPD4S009DBVRG4 ACTIVE -40 to 85 0.29 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
TPD4S009DCKR ACTIVE -40 to 85 0.26 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
TPD4S009DCKRG4 ACTIVE -40 to 85 0.26 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
TPD4S009DGSR ACTIVE -40 to 85 0.33 | 1ku MSOP (DGS) | 10 2500 | LARGE T&R  
TPD4S009DRYR ACTIVE -40 to 85 0.33 | 1ku SON (DRY) | 6 5000 | LARGE T&R  
TPD4S009 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TPD4S009DBVR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TPD4S009DBVR TPD4S009DBVR
TPD4S009DBVRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TPD4S009DBVRG4 TPD4S009DBVRG4
TPD4S009DCKR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TPD4S009DCKR TPD4S009DCKR
TPD4S009DCKRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TPD4S009DCKRG4 TPD4S009DCKRG4
TPD4S009DGSR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TPD4S009DGSR TPD4S009DGSR
TPD4S009DRYR TBD  Call TI  Call TI TPD4S009DRYR TPD4S009DRYR
TPD4S009 应用技术支持与电子电路设计开发资源下载
  1. TPD4S009 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器ESD 解决方案选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 接口选择指南 (Rev. D) (PDF 2994 KB)
  5. ESD Protection Guide (PDF 2885 KB)
  6. Reading and Understanding an ESD Protection Datasheet (PDF 2523 KB)
  7. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  8. Isolated CAN Reference Design (PDF 48 KB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Isolated CAN EVM User's Guide (PDF 1168 KB)
  12. Energy Harvesting: Solar Solutions Guide (PDF 409 KB)
  13. Analog Signal Chain Guide (8.62 MB)
  14. Industrial Interface IC Solutions (101 KB)