TPIC1021 汽车类 LIN 物理接口

The TPIC1021 is the LIN (Local Interconnect Network) physical interface, which integrates the serial transceiver with wake up and protection features. The LIN bus is a single wire, bi-directional bus typically used for low-speed in-vehicle networks using baud rates between 2.4 kbps and 20 kbps.

The LIN bus has two logical values: the dominant state (voltage near ground) represents a logic ’0’ and the recessive state (voltage near battery) and represents logic ’1’.

In the recessive state the LIN bus is pulled high by the TPIC1021’s internal pull-up resistor (30k) plus a series diode.

The LIN Protocol output data stream on the TXD pin is converted by the TPIC1021 into the LIN bus signal through a current limited, wave-shaping low-side driver with control as outlined by the LIN Physical Layer Specification Revision 2

TPIC1021
Footprint TPIC1021  
Spec Referenced LIN 2.0  
LIN Voltage(Min)(V) -40  
LIN Voltage(Max)(V) 40  
Operating Voltage(Min)(V) 7  
Operating Voltage(Max)(V) 27  
ESD LIN (HBM)(kV) 12  
LIN Bus Wake-up Capable Yes  
External Wake-up Pin Yes  
Dominant State Time-out Protection Yes  
I/O Voltages for MCU(V) 3.3,5
TPIC1021 特性
TPIC1021 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
TPIC1021D ACTIVE -40 to 125 0.48 | 1ku SOIC (D) | 8 75  
TPIC1021DG4 ACTIVE   0.48 | 1ku SOIC (D) | 8 75  
TPIC1021DR ACTIVE -40 to 125 0.40 | 1ku SOIC (D) | 8 2500 | LARGE T&R  
TPIC1021DRG4 ACTIVE   0.40 | 1ku SOIC (D) | 8 2500  
TPIC1021 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TPIC1021D Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TPIC1021D TPIC1021D
TPIC1021DG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TPIC1021DG4 TPIC1021DG4
TPIC1021DR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TPIC1021DR TPIC1021DR
TPIC1021DRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TPIC1021DRG4 TPIC1021DRG4
TPIC1021 应用技术支持与电子电路设计开发资源下载
  1. TPIC1021 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LIN 收发器选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)