多芯片分立器件

Part Number Configuration (Q1)VCEO (Max)(V) (Q1)VDS (Max)(V) (Q1)VR (Max)(V) (Q1)IC (Max)(A) (Q1)ID (Max)(A) (Q2)VCEO (Max)(V) (Q2)VDS (Max)(V) (Q2)VR (Max)(V) (Q2)IC (Max)(A) (Q2)ID (Max)(A) Number of pins Surface mount package Package name(Toshiba)
HN2E04F PNP + Small-signal SW diode -120 -0.1 80 6 Y SM6
SSM5G02TU P-ch MOS + SBD -12 -1 12 5 Y UFV
SSM5G06FE P-ch MOS + SBD -20 -0.1 12 5 Y ESV
SSM5G09TU P-ch MOS + SBD -12 -1.5 12 5 Y UFV
SSM5G11TU P-ch MOS + SBD -30 -1.3 5 Y UFV
SSM5H01TU N-ch MOS + SBD 30 1.4 20 5 Y UFV
SSM5H06FE N-ch MOS + SBD 20 0.1 12 5 Y ESV
SSM5H08TU N-ch MOS + SBD 20 1.5 20 5 Y UFV
SSM5H11TU N-ch MOS + SBD 30 1.9 5 Y UFV
SSM5H16TU N-ch MOS + SBD 30 1.9 5 Y UFV
SSM5H90ATU N-ch MOS + SW-DI 20 2.4 80 5 Y UFV
SSM6G18NU P-ch MOS + SBD -20 -2 6 Y UDFN6
SSM6H19NU N-ch MOS + SBD 40 2 40 6 Y UDFN6
TPCP8R01 N-ch MOS + ZNR 60 2 8 Y PS-8