EMIF02-MIC06F3：2-line EMI filter and ESD protection for microphones

The EMIF02-MIC06F3 is a highly integrated device designed to suppress EMI/RFI noise for dual microphone line filtering.

The EMIF02-MIC06F3 Flip-Chip packaging means the package size is equal to the die size. That's why EMIF02-MIC06F3 is a very small device.

Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV.

Key Features

2-line symmetrical low-pass filter
Lead-free package
Very low PCB space consuming: < 1.5 mm2
Very thin package: 0.65 mm
High efficiency in ESD suppression IEC 61000-4-2 level 4
High reliability offered by monolithic integration
High reduction of parasitic elements through integration and wafer level packaging
Complies with the following standards
- IEC 61000-4-2 level 4:
  - 15 kV (air discharge)
  - 8 kV (contact discharge)
- 8 kV (contact discharge)

Description	Version	Size
DS5981: 2-line IPAD™ EMI filter and ESD protection	5.0	1 MB

Description	Version	Size
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use	5.0	261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use	8.0	251 KB

Description	Version	Size
TN1200: Micro-bump Flip Chip: package description and recommendations for use	1.0	280 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches	4.0	330 KB

Description	Version	Size
Enhanced ESD protection and EMI filters for audio/video interfaces	1.0	823 KB
The ultimate HDMI control-link buffer	2.1	478 KB

型号	Package	Packing Type	Unit Price (US$) *	Quantity	ECCN (EU)	ECCN (US)	Country of Origin
EMIF02-MIC06F3	Chip Scale Package 0.4mm pitch	Tape And Reel	0.406	1000	NEC	EAR99	CHINA

型号	Package	Grade	RoHS Compliance Grade	Material Declaration**
EMIF02-MIC06F3	Chip Scale Package 0.4mm pitch	Industrial	Ecopack2	md_m0-wspc-csps0.4-wspc-7-10_k9m0-wspc-emi2h3g-wspc-lock.pdf md_m0-wspc-csps0.4-wspc-7-10_k9m0-wspc-emi2h3g.xml