EMIF03-SIM02F2：3-line EMI filter and ESD protection for SIM card interfaces
The EMIF03-SIM02F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference.The EMIF03 Flip Chip packaging means the package size is equal to the die size.
This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15kV.
Key Features
- High reliability offered by monolithic integration
- High efficiency in ESD suppression
- EMI symmetrical (I/O) low-pass filter
- Lead-free package
- High efficiency in EMI filtering
- Very thin package: 0.65 mm
- High reduction of parasitic elements through integration and wafer level packaging
- Very low PCB space consuming: 1.42 mm x 1.42 mm
产品规格
应用手册
Technical Notes & Articles
宣传册
样片和购买
| 型号 | Package | Packing Type | Unit Price (US$)
* | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
|---|
| EMIF03-SIM02F2 | Chip Scale Package 0.5mm pitch | Tape And Reel | 0.272 | 1000 | NEC | EAR99 | - |
质量和可靠性
