BAL-CC25-01D3:50Ω nominal input / conjugate match balun to CC253x, CC254x, CC257x, CC852x, CC853x, with integrated harmonic filter

STMicroelectronics BAL-CC25-01D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC25xx and CC85xx RF transceivers.

It’s a design using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance.

Key Features

  • 2.45 GHz balun with integrated matching network
  • Matching optimized for following chip-sets:
    • CC2530, CC2531, CC2533
    • CC2540
    • CC2543, CC2544, CC2545
    • CC2570, CC2571
    • CC8520, CC8521
    • CC8530, CC82531
  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Coated Flip-Chip on glass
  • Small footprint: < 0.88 mm²
  • Benefits
    • Very low profile
    • High RF performance
    • PCB space saving versus discrete solution
    • BOM count reduction
    • Efficient manufacturability
Product Specifications
DescriptionVersionSize
DS9673: 50 ohm, conjugate match to CC253x, CC254x, CC257x, CC852x, CC853x, transformer balun4.0467 KB
Application Notes
DescriptionVersionSize
AN4315: BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers2.1688 KB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
Board Manufacturing Specifications
DescriptionVersionSize
BAL-CC25-01D3 gerber files1.0314 KB
Flyers
DescriptionVersionSize
High-quality RF IPD baluns for ISM bands simplify RF complexity.2.0942 KB
Brochures
DescriptionVersionSize
Products and Solutions for Factory Automation and Control1.03 MB
Semiconductor solutions for healthcare applications1.0665 KB
Sample & Buy
Part NumberPackagePacking TypeMinimum Sellable QuantityUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
BAL-CC25-01D3Chip Scale Package 0.4mm pitchTape And Reel50000.113100NECEAR99CHINA
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
BAL-CC25-01D3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-blcc25a_vers2_sdm_signed.pdf
md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-blcc25a_vers2.xml
50 ohm, conjugate match to CC253x, CC254x, CC257x, CC852x, CC853x, transformer balun BAL-CC25-01D3
BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers BAL-NRF02D3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches BAL-CC25-01D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches BAL-NRF02D3
STEVAL-SPIMD20V1 demonstration kit based on the SPIMD20 integrated motor drive STEVAL-SPIMD20V1
STM8L101xx device limitations STM8L101G3
md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-blcc25a_vers2_sdm_signed.pdf BAL-CC25-01D3
md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-blcc25a_vers2.xml BAL-CC25-01D3