BLF7G27L-200PB：功率LDMOS晶体管
200 W LDMOS功率晶体管，适合2600 MHz至2700 MHz频率范围的基站应用。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 2600 | 2700 | MHz | ||
| PL(1dB) | nominal output power at 1 dB gain compression | 200 | W | |||
| Gp | power gain | VDS = 32 V | 14.8 | 16.5 | 17.7 | dB |
| RLin | input return loss | VDS = 32 V; IDq = 1700 mA | -15 | -5 | dB | |
| ηD | drain efficiency | VDS = 32 V; 2620 MHz ≤ f ≤ 2690 MHz; IDq = 1700 mA | 25.5 | 29 | % | |
| PL(AV) | average output power | 65 | W | |||
| ACPR | adjacent channel power ratio | PL(AV) = 65 W; VDS = 32 V; 2620 MHz ≤ f ≤ 2690 MHz; IDq = 1700 mA | -30 | -27 | dBc |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BLF7G27L-200PB |  CDFM8 (SOT1110A) | sot1110a_po | Reel 13" Q1/T1 | 量产 | Standard Marking | BLF7G27L-200PB,118( 9340 653 17118 ) | |
| Bulk Pack | 量产 | Standard Marking | BLF7G27L-200PB,112( 9340 653 17112 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | DRAIN1 | drain 1 |  |  |
| 2 | DRAIN2 | drain 2 | ||
| 3 | GATE1 | gate 1 | ||
| 4 | GATE2 | gate 2 | ||
| 5 | SOURCE | source | ||
| 6 | SENSE DRAIN | sense drain | ||
| 7 | SENSE DRAIN | sense drain | ||
| 8 | SENSE GATE | sense gate | ||
| 9 | SENSE GATE | sense gate |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BLF7G27L-200PB | BLF7G27L-200PB,118 |   | Always Pb-free | NA | NA |
| BLF7G27L-200PB | BLF7G27L-200PB,112 | | Always Pb-free | NA | NA |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BLF7G27L-200PB (中文) | Power LDMOS transistor | Data sheet | 2012-02-20 | |
| AN10896 | Mounting and Soldering of RF transistors | Application note | 2015-03-24 | |
| 75017347 | Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| PCB_Design_BLF7G27L-200PB_Data-sheet | PCB Design BLF7G27L-200PB (Data sheet) | Design support | zip | 2012-02-27 |
| fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | 2015-05-19 | |
| BLF7G27L-200PB_ADS-2009_Model | BLF7G27L-200PB ADS-2009 Model | Simulation model | zip | 2013-06-25 |
| BLF7G27L-200PB_ADS-2011_Model | BLF7G27L-200PB ADS-2011 Model | Simulation model | zip | 2014-04-24 |
| sot1110a_po | flanged LDMOST ceramic package; 2 mounting holes; 8 leads | Outline drawing | 2010-04-02 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BLF7G27L-200PB | 9340 653 17118 | BLF7G27L-200PB,118 |
| BLF7G27L-200PB | 9340 653 17112 | BLF7G27L-200PB,112 |
模型
| 标题 | 类型 | 日期 |
|---|---|---|
| BLF7G27L-200PB ADS-2009 Model | Simulation model | 2013-06-25 |
| BLF7G27L-200PB ADS-2011 Model | Simulation model | 2014-04-24 |
其它
| 标题 | 类型 | 日期 |
|---|---|---|
| PCB Design BLF7G27L-200PB (Data sheet) | Design support | 2012-02-27 |
- Power LDMOS transistor BLF7G27L-200PB
- Mounting and Soldering of RF transistors aerospace_defense
- Enabling the Mobile Experience rf
- Fatigue in aluminum bond wires gan_devices
- RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
- flanged LDMOST ceramic package; 2 mounting holes; 8 leads BLF7G27L-200PB
- BLF7G27L-200PB ADS-2009 Model BLF7G27L-200PB
- BLF7G27L-200PB ADS-2011 Model BLF7G27L-200PB
- PCB Design BLF7G27L-200PB (Data sheet) BLF7G27L-200PB
