TLK2521 1.0-2.5Gbps 18 位串行器/解串器

The TLK2521 is a member of the WizardLink family of multi-gigabit transceivers, intended for use in high-speed bidirectional point-to-point data transmission systems. The TLK2521 supports an effective serial interface speed of 1 Gbps to 2.5 Gbps, providing up to 2.25 Gbps of data bandwidth.

The primary application of the TLK2521 is to provide high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50 . The transmission media can be printed circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.

The TLK2521 can also be used to replace parallel data transmission architectures by providing a reduction in the number of traces, connector pins, and transmit/receive pins

TLK2521
mW per Serial Channel 425  
Gbps per Serial Channel(Min) 1  
Gbps per Serial Channel(Max) 2.5  
ICC(Max)(mA) 170  
Power Consumption(Nom)(mW) 424  
Number of Serial Channels 1  
Parallel Bus Width 18  
Serial I/F VML  
Parallel I/F LVTTL  
Operating Temperature Range(C) -40 to 85  
Pin/Package 64HTQFP  
VCC(Min)(V) 2.3  
VCC(Max)(V) 2.7  
VCC(Nom)(V) 2.5  
VIH(Min)(V) 2  
VIH(Max)(V) 3.6  
VIL(Max)(V) 0.8  
Vid(Min)(Vp-p) 0.2  
Vod(Min)(Vp-p) 1.35  
Vod(Max)(Vp-p) 2.56
TLK2521 特性
TLK2521 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
TLK2521IPAP ACTIVE -40 to 85 12.00 | 1ku HTQFP (PAP) | 64 160 | JEDEC TRAY (10+1)  
TLK2521IPAPG4 ACTIVE -40 to 85 12.00 | 1ku HTQFP (PAP) | 64 160 | JEDEC TRAY (10+1)  
TLK2521IPAPR PREVIEW -40 to 85   HTQFP (PAP) | 64    
TLK2521 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TLK2521IPAP Green (RoHS & no Sb/Br)  CU NIPDAU  Level-3-260C-168 HR TLK2521IPAP TLK2521IPAP
TLK2521IPAPG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-3-260C-168 HR TLK2521IPAPG4 TLK2521IPAPG4
TLK2521 应用技术支持与电子电路设计开发资源下载
  1. TLK2521 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器串行器和解串器选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
  6. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  7. 接口选择指南 (Rev. D) (PDF 2994 KB)
  8. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  9. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  10. Isolated RS-485 Reference Design (PDF 80 KB)
  11. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  12. Analog Signal Chain Guide (8.62 MB)
  13. Industrial Interface IC Solutions (101 KB)
TLK2521 工具和软件
培训内容 型号 软件/工具类型
TLK2521 评估模块 TLK2521EVM 开发电路板/EVM
TLK2521FPGAEVM 评估模块 TLK2521FPGAEVM 开发电路板/EVM
TLK2521SMAEVM 评估模块 TLK2521SMAEVM 开发电路板/EVM